• Mini Air-Cooled System Central Processing Unit (CPU) Heat Sink
  • Mini Air-Cooled System Central Processing Unit (CPU) Heat Sink
Mini Air-Cooled System Central Processing Unit (CPU) Heat Sink

Mini Air-Cooled System Central Processing Unit (CPU) Heat Sink

جزئیات محصول:

محل منبع: Dongguan , Guangdong ، چین
نام تجاری: Uchi
گواهی: SMC
شماره مدل: هیت سینک باله دار 02

پرداخت:

مقدار حداقل تعداد سفارش: 100 عدد
قیمت: قابل مذاکره
شرایط پرداخت: T/T، پی پال، وسترن یونیون، مانی گرام
قابلیت ارائه: 50000000 قطعه در هر ماه
بهترین قیمت مخاطب

اطلاعات تکمیلی

درجه: 6000 سری خدمات پردازش: برش، مشت زدن، روکش کردن، خم کردن، سوراخ کردن
خلق و خوی: T3 ~ T8 بسته بندی: کارتن PE BAG
تحمل: ± 1٪ استاندارد: هیت سینک آلومینیومی متوسط ​​و با کیفیت
روند کار: ماشینکاری Cnc مواد: آلومینیوم مس
اندازه جعبه بسته بندی: 42.5*33*18 سانتی متر وزن محصول: 0.187 کیلوگرم
برجسته کردن:

Mini CPU air-cooled heat sink,Compact CPU cooling system,Air-cooled CPU heat sink

,

Compact CPU cooling system

,

Air-cooled CPU heat sink

توضیحات محصول

Mini Air-Cooled System Central Processing Unit (CPU) Heat Sink
Our mini air-cooled CPU heat sink features advanced thermal management technology designed for optimal performance and reliability in demanding applications.
Design Features & Technology
The accordion-style fin radiator design maximizes surface area through precisely bent thin aluminum plates, while vortex radiator blades are strategically tilted to enhance air circulation and heat dissipation efficiency.
  • Material Excellence: Aluminum alloy construction delivers optimal cost-performance ratio with excellent thermal conductivity
  • Enhanced Surface Area: Expanded convection surface ensures superior heat dissipation through optimized air contact
  • Precision Engineering: Thin base design prevents thermal resistance while dense diversion grooves maximize air contact area
High-End Manufacturing Applications
Advanced thermal solutions for cutting-edge industries requiring superior heat management:
  • Semiconductor & Chip Manufacturing: Overcoming thermal conductivity limitations in advanced packaging technologies including 3D stacking
  • AI Computing & Data Centers: Addressing surging heat flux density that challenges traditional cooling methods
  • Aerospace: Specialized solutions for extreme temperature environments and vacuum conditions where convection is limited
Mini Air-Cooled System Central Processing Unit (CPU) Heat Sink 0
Everyday Applications
Reliable thermal management solutions for consumer and commercial products:
  • Digital Devices: Internal cooling modules for computers, mobile phones, and gaming consoles
  • Communication Equipment: Large heat sinks ensuring stability in high-speed data transmission systems
  • Household Appliances: Efficient heat transfer in compressors and condenser units
  • LED Lighting: Thermal designs that ensure luminous efficacy and extended service life
  • New Energy Vehicles: Sophisticated liquid cooling systems for optimal operating temperatures
Mini Air-Cooled System Central Processing Unit (CPU) Heat Sink 1
Manufacturing Capabilities
Advanced Equipment Infrastructure
Our mold workshop features comprehensive manufacturing capabilities with state-of-the-art equipment:
  • 22 electric discharge machines (EDM) including 2 MAKINO mirror EDM machines
  • 9 wire-cut EDM machines (3 Seibu and 1 Sodick imported from Japan)
  • 7 spark erosion machines, 10 grinding machines, 2 milling machines, and 1 lathe
Specification Capacity
Table Size 500×350 mm
Rapid Traverse Speed 5000 mm/min
Maximum Workpiece Weight 500 kg
Maximum Electrode Weight 50 kg
Precision Machining Technology
Utilizing SuperSpark4 and Intelligent Expert System (IES) technologies for advanced adaptive power supply and jump control, ensuring stable EDM processes and superior machining precision. Our ultra-surface and ultra-edge generator technologies deliver excellent surface finish and metallurgical quality.
Mini Air-Cooled System Central Processing Unit (CPU) Heat Sink 2 Mini Air-Cooled System Central Processing Unit (CPU) Heat Sink 3 Mini Air-Cooled System Central Processing Unit (CPU) Heat Sink 4
Product Applications
Mini Air-Cooled System Central Processing Unit (CPU) Heat Sink 5
Quality Assurance
We maintain rigorous quality standards with comprehensive testing equipment:
  • 1 Coordinate Measuring Machine
  • 1 Projector Instrument
  • 2 Water High Pressure Testing Machines
  • 4 Thermal Resistance Testing Machines
  • 2 Liquid Leakage Testing Machines
Mini Air-Cooled System Central Processing Unit (CPU) Heat Sink 6
Customer Service Commitment
  • Prompt response to all inquiries
  • Competitive pricing with guaranteed quality
  • Efficient production scheduling
  • Optimal transportation solutions
  • Comprehensive technical support
Frequently Asked Questions
Are you a trading company or manufacturer?
We are a professional manufacturer of heat sinks and water cooling plates with extensive experience and a strong technical team, featuring automated and mechanized production.
Have you exported goods before and to which regions?
60% of our total production is exported to Japan, India, UK, Canada, USA, and Brazil.
How many employees do you have?
Approximately 100 employees across sales, purchasing, engineering, QA, warehouse, and production departments.
Can you provide samples if we agree with the design?
Yes, we provide samples for confirmation before mass production, along with technical drawings if required.
What packing methods do you use?
Customized packing with normal cartons and tight-proof fabric or wooden cartons for optimal protection during transportation.
Do you provide technical support for product issues?
All products are fully inspected before shipping. For any issues, we provide immediate technical solutions.

می خواهید اطلاعات بیشتری در مورد این محصول بدانید
Mini Air-Cooled System Central Processing Unit (CPU) Heat Sink آیا می توانید جزئیات بیشتری مانند نوع ، اندازه ، مقدار ، مواد و غیره برای من ارسال کنید
با تشکر!