Heat Exchanger Liquid Cooled Cold Plate 

Product parameters of heat exchanger liquid cooled cold plate

Material: AL 1100

Size:5x7x3cm

Weight: 0.15kg

Technology: Fsw cooling

Feature: High cooling capability and Fast cooling

Surface treatment: oil cleared,cleaned and passivation

Heat conducting power: 260W

Liquid Cooled Cold Plate Heat Exchanger

I. Core Working Principle

1. Thermal Conduction & Heat Absorption

    

   The metallic baseplate of the cold plate is tightly attached to heat-generating devices such as CPUs, GPUs, and IGBTs. Thermal Interface Material (TIM) is used to eliminate air gaps, enabling efficient heat transfer into the cold plate.
    
2. Convective Heat Transfer

    

   Coolant (water, glycol solution, dielectric fluid, etc.) flows through precision-designed internal channels, absorbing heat from the baseplate via forced convection.
    
3. Heat Transportation

    

   The heated coolant exits the cold plate, releases heat in an external CDU (Cooling Distribution Unit) or radiator, and is recirculated after cooling.
    

II. Main Structure & Types

1. Core Materials

• Copper (Cu): Extremely high thermal conductivity (~400 W/m·K), optimal heat dissipation performance, widely used for high-performance chips.
• Aluminum (Al): Low cost, lightweight, commonly applied in power batteries and industrial equipment.

2. Internal Channel Structures

Tube-in-Plate Liquid Cooling Plate

• Structure: Grooves machined in the metal baseplate, with copper tubes embedded and hermetically welded.
• Features: Mature manufacturing process, high pressure resistance, moderate cost.

Folded / Stacked Type (Milled & Welded)

• Structure: Complex flow channels milled into the baseplate, then sealed and welded with a cover plate.
• Features: Flexible channel design, large heat exchange area, low thermal resistance.

Micro-channel Type

• Structure: Ultra-fine flow channels (width ≤ 1 mm), providing extremely high specific surface area.
• Features: Ultra-high heat dissipation (heat flux exceeding 500 W/cm²), high pressure drop, strict requirements for coolant cleanliness.

Pin-fin / Skived Fin Type

• Structure: Integrated pin-shaped or thin fin structures formed directly from the baseplate.
• Features: No welding-induced thermal resistance, strong turbulence, high heat dissipation efficiency.

III. Key Performance Parameters

• Thermal Resistance (Rth): Core performance indicator, typically 0.02 ~ 0.1 ℃/W; lower value means better heat dissipation.
• Heat Dissipation Capacity: Single cold plate can handle 500W ~ 2000W+ of power.
• Pressure Drop (ΔP): Flow resistance of the coolant, affecting pump power consumption.
• Operating Pressure: Standard rated pressure 2~5 bar, burst pressure generally ≥ 8 bar.

IV. Main Application Fields

• Data Centers / High-Performance Computing (HPC): Cooling for AI server GPUs and CPUs, supporting high-density computing power.
• New Energy Vehicles: Thermal management of power battery packs, heat dissipation for motor controller IGBTs.
• Industrial & Medical Equipment: Lasers, power inverters, medical imaging devices.
• Aerospace: High-reliability heat dissipation for radar systems, satellite payloads, etc.

V. Core Advantages

• High Heat Dissipation Efficiency: 10~25 times the capacity of air cooling.
• Low Noise & Energy Saving: No high-speed fan noise; system PUE can be reduced to below 1.1.
• Precise Temperature Control: Small temperature fluctuations, extending service life of electronic components.
• Compact Size: Smaller volume than air-cooled heat sinks, suitable for highly integrated equipment.

VI. Difference from Traditional Plate Heat Exchangers

• Liquid Cooling Cold Plate: Absorbs heat from one side, mainly used for device-level / chip-level cooling with direct contact to heat sources.
• Plate Heat Exchanger (PHE): Performs heat exchange on both sides, used for system-level liquid-to-liquid / liquid-to-gas heat transfer (e.g., inside a CDU).